DocumentCode
748276
Title
Correlation between channel hot-electron degradation and radiation-induced interface trapping in MOS devices
Author
Palkuti, L.J. ; Ormond, R.D. ; Hu, C. ; Chung, J.
Author_Institution
Adv. Res. & Applications Corp., Sunnyvale, CA, USA
Volume
36
Issue
6
fYear
1989
fDate
12/1/1989 12:00:00 AM
Firstpage
2140
Lastpage
2146
Abstract
A correlation between channel hot-carrier induced degradation is conventional-drain NMOSFETS and radiation-induced transconductance (g m) degradation is described. The device lifetime, τHE, was proportional to the 1.5 power D ]EFF, where D EFF is the radiation dose when Δg m/g m=0.5. These results indicate that radiation-induced interface trapping is a strong indicator of hot-electron-device lifetime. The proposed radiation test can be applied to devices with both radiation-hard and radiation-soft field oxide. Initial results on lightly-doped-drain (LDD) devices indicate that correlation between hot-electron degradation and radiation-induced interface trapping is strongly dependent on the design of the LDD
Keywords
X-ray effects; hot carriers; insulated gate field effect transistors; interface electron states; radiation hardening (electronics); semiconductor device testing; MOS devices; NMOSFETS; X-ray irradiation; hot-electron degradation; hot-electron-device lifetime; lightly doped drain device; radiation hardening; radiation induced transconductance degradation; radiation test; radiation-induced interface trapping; radiation-soft field oxide; Channel hot electron injection; Degradation; Electron traps; Hot carrier effects; Hot carriers; Radiation monitoring; Silicon; Testing; Transconductance; Very large scale integration;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.45416
Filename
45416
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