• DocumentCode
    748276
  • Title

    Correlation between channel hot-electron degradation and radiation-induced interface trapping in MOS devices

  • Author

    Palkuti, L.J. ; Ormond, R.D. ; Hu, C. ; Chung, J.

  • Author_Institution
    Adv. Res. & Applications Corp., Sunnyvale, CA, USA
  • Volume
    36
  • Issue
    6
  • fYear
    1989
  • fDate
    12/1/1989 12:00:00 AM
  • Firstpage
    2140
  • Lastpage
    2146
  • Abstract
    A correlation between channel hot-carrier induced degradation is conventional-drain NMOSFETS and radiation-induced transconductance (gm) degradation is described. The device lifetime, τHE, was proportional to the 1.5 power D]EFF, where DEFF is the radiation dose when Δgm/gm=0.5. These results indicate that radiation-induced interface trapping is a strong indicator of hot-electron-device lifetime. The proposed radiation test can be applied to devices with both radiation-hard and radiation-soft field oxide. Initial results on lightly-doped-drain (LDD) devices indicate that correlation between hot-electron degradation and radiation-induced interface trapping is strongly dependent on the design of the LDD
  • Keywords
    X-ray effects; hot carriers; insulated gate field effect transistors; interface electron states; radiation hardening (electronics); semiconductor device testing; MOS devices; NMOSFETS; X-ray irradiation; hot-electron degradation; hot-electron-device lifetime; lightly doped drain device; radiation hardening; radiation induced transconductance degradation; radiation test; radiation-induced interface trapping; radiation-soft field oxide; Channel hot electron injection; Degradation; Electron traps; Hot carrier effects; Hot carriers; Radiation monitoring; Silicon; Testing; Transconductance; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.45416
  • Filename
    45416