DocumentCode
748358
Title
Total dose radiation effects for implanted buried oxides
Author
Brady, F.T. ; Krull, W.A. ; Li, S.S.
Author_Institution
Harris Semicond., Melbourne, FL, USA
Volume
36
Issue
6
fYear
1989
fDate
12/1/1989 12:00:00 AM
Firstpage
2187
Lastpage
2191
Abstract
It is noted that the oxygen implantation process is now the most accepted means of forming an SOI substrate. A technique based on high-frequency C -V measurements for extracting the fixed charge, interface state, and doping densities at both of the interfaces associated with this buried oxide is described. The technique was used to trace the evolution of the charge densities with irradiation at both oxide interfaces. The densities of trapped holes and generated interface states were found to be low. The effect of a substrate bias on the radiation response was characterized, showing that a bias exists that minimizes hole trapping, and that the substrate bias eliminates the differences due to the SIMOX (separation by implantation of oxygen) process variations
Keywords
ion implantation; radiation hardening (electronics); semiconductor technology; semiconductor-insulator boundaries; O implantation; SIMOX; SOI substrate; Si-SiO2; doping densities; fixed charge; high-frequency C-V measurements; implanted buried oxides; interface state; oxygen implantation process; radiation response; separation by implantation of oxygen; substrate bias; total dose radiation effect; Capacitance-voltage characteristics; Capacitors; Frequency; Implants; Interface states; Paramagnetic resonance; Radiation effects; Silicon; Substrates; Threshold voltage;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.45423
Filename
45423
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