• DocumentCode
    748358
  • Title

    Total dose radiation effects for implanted buried oxides

  • Author

    Brady, F.T. ; Krull, W.A. ; Li, S.S.

  • Author_Institution
    Harris Semicond., Melbourne, FL, USA
  • Volume
    36
  • Issue
    6
  • fYear
    1989
  • fDate
    12/1/1989 12:00:00 AM
  • Firstpage
    2187
  • Lastpage
    2191
  • Abstract
    It is noted that the oxygen implantation process is now the most accepted means of forming an SOI substrate. A technique based on high-frequency C-V measurements for extracting the fixed charge, interface state, and doping densities at both of the interfaces associated with this buried oxide is described. The technique was used to trace the evolution of the charge densities with irradiation at both oxide interfaces. The densities of trapped holes and generated interface states were found to be low. The effect of a substrate bias on the radiation response was characterized, showing that a bias exists that minimizes hole trapping, and that the substrate bias eliminates the differences due to the SIMOX (separation by implantation of oxygen) process variations
  • Keywords
    ion implantation; radiation hardening (electronics); semiconductor technology; semiconductor-insulator boundaries; O implantation; SIMOX; SOI substrate; Si-SiO2; doping densities; fixed charge; high-frequency C-V measurements; implanted buried oxides; interface state; oxygen implantation process; radiation response; separation by implantation of oxygen; substrate bias; total dose radiation effect; Capacitance-voltage characteristics; Capacitors; Frequency; Implants; Interface states; Paramagnetic resonance; Radiation effects; Silicon; Substrates; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.45423
  • Filename
    45423