Abstract :
The author, Michael Gaynor, has a lot of experience in packaging and shares a broad view of the field in this book. He provides a historical foundation as well as a view of the state of the art on package design and test. One of the critical aspects of the text is that it is not a discussion about the capabilities of each technology as much as it is a practical review of what the various packaging alternatives can provide. Some of the topics covered include: vias; interconnects; inductors; capacitors; assembly processes; and advanced packaging techniques. Several case studies and many examples of impedance matching networks, filters, and power packaging are included. Thus is a very useful book for anyone who needs to know about packaging, the interface, and the limitations packaging creates for a product.
