Densely packed optoelectronic interconnect using micromachined springs

Author

Chua, C.L. ; Fork, D.K. ; Hantschel, T.

Author_Institution

Xerox Palo Alto Res. Center, CA, USA

Volume

14

Issue

6

fYear

2002

fDate

6/1/2002 12:00:00 AM

Firstpage

846

Lastpage

848

Abstract

We demonstrate a novel optoelectronic packaging technology interconnecting 200 element independently addressable vertical-cavity surface-emitting laser arrays on 6-μm pitch to silicon driver chips with equally dense output lines. The room-temperature flip-chip process utilizes micromachined cantilevers for establishing electrical contact. Thermal cycling and thermal shock tests show excellent package reliability.

Keywords

flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated optoelectronics; micromachining; optical interconnections; semiconductor laser arrays; surface emitting lasers; thermal shock; 200 element; 6 micron; Si; densely packed optoelectronic interconnect; electrical contact; equally dense output lines; excellent package reliability; independently addressable vertical-cavity surface-emitting laser arrays; micromachined cantilevers; micromachined springs; optoelectronic packaging technology; room-temperature flip-chip process; silicon driver chips; thermal cycling; thermal shock tests; Atomic layer deposition; Contacts; Optical arrays; Semiconductor device packaging; Semiconductor laser arrays; Springs; Stress; Substrates; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2002.1003113

Filename

1003113