DocumentCode
749389
Title
Three-dimensional Medipix-a new generation of X-ray detectors
Author
Wright, V.A. ; Davidson, W.D. ; Melone, J.J. ; O´Shea, V. ; Smith, K.M. ; Donohue, L. ; Lea, L. ; Robb, K. ; Nenonen, S. ; Sipila, H.
Author_Institution
Univ. of Glasgow, UK
Volume
52
Issue
5
fYear
2005
Firstpage
1873
Lastpage
1876
Abstract
Three-dimensional (3-D) detectors have many potential advantages over standard planar devices and for a range of applications, e.g., high energy physics, synchrotron radiation detection and medical imaging. One such area is minimizing the effects due to charge sharing between adjacent pixels. Simulations of pixel detector compatible with the Medipix2 chip show that 3-D detectors have significant advantages in this area. In addition, a 64×64 pixel 3-D detector designed for read-out by the Medipix1 chip has been fabricated. The sensors have been characterized using current-voltage and capacitance measurements. They are currently being bump-bonded to the Medipix1 chip at the University of Freiburg in order for the complete system to be evaluated using a X-ray source.
Keywords
X-ray detection; position sensitive particle detectors; radiation hardening (electronics); readout electronics; semiconductor counters; synchrotron radiation; Medipix2 chip; X-ray detectors; X-ray source; bump-bonded; capacitance measurements; chip read-out; current-voltage measurement; high energy physics; medical imaging; pixel detector; planar devices; radiation hardening; semiconductor detector; synchrotron radiation detection; three-dimensional detectors; Biomedical imaging; Electrodes; Geometry; Optoelectronic and photonic sensors; Programmable control; Radiation detectors; Semiconductor radiation detectors; Synchrotron radiation; X-ray detection; X-ray detectors; 3-D detectors; Charge sharing; medical imaging; radiation hardness; semiconductors;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2005.856598
Filename
1546519
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