DocumentCode :
749527
Title :
Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis
Author :
Jang, Changsoo ; Goswami, Arindam ; Han, Bongtae
Author_Institution :
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD
Volume :
18
Issue :
3
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
577
Lastpage :
587
Abstract :
A gas transport mechanism is studied to characterize the hermetic behavior of polymer-sealed microelectromechanical systems packages. Diffusion-based governing equations, which are fundamentally different from the conduction-based governing equations used for metallic seals, are proposed to predict a change in cavity pressure. An effective numerical scheme is developed to implement the governing equations. The validity of the governing equations is corroborated by the optical leak test. The verified gas diffusion model is utilized to investigate the effect of the diffusion properties and geometries of polymeric seals on the gas leak behavior.
Keywords :
diffusion; electronics packaging; hermetic seals; leak detection; micromechanical devices; polymers; MEMS packages; cavity pressure; diffusion-based governing equations; gas diffusion analysis; gas leak behavior; hermeticity; metallic seals; microelectromechanical systems packages; optical leak test; polymeric seals; Gas diffusion; gas leakage; hermeticity; microelectromechanical systems (MEMS) package; polymer seals;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2009.2016283
Filename :
4838947
Link To Document :
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