Title :
Electromagnetic performance of innovative lightweight shields to reduce radiated emissions from PCBs
Author :
Sarto, Maria Sabrina ; Di Michele, Sergio ; Leerkamp, Peter
Author_Institution :
Dept. of Electr. Eng., Univ. of Rome "La Sapienza", Italy
fDate :
5/1/2002 12:00:00 AM
Abstract :
An innovative shielding concept to reduce radiated emissions from components and tracks on printed-circuit boards is proposed. The new shield is made of a polycarbonate foil, which is coated by a thin film of nickel (only 50 nm in thickness) and by a 5-μm thick layer of tin, and successively thermoformed. The innovative characteristics of such a high-technology shield are the extremely light weight, the high thermoformability, good shielding performance against both far-field and near field sources, low production costs, low installation costs, minimum occupied volume. The mechanical, chemical, and electromagnetic performance of the new shield has been characterized experimentally. Different bonding solutions are tested in order to optimize the shielding performance of the screening cover installed on a conductive ground plane
Keywords :
conducting bodies; earthing; electromagnetic fields; electromagnetic interference; electromagnetic shielding; interference suppression; printed circuits; 5 micron; 50 nm; Ni; PCB; Sn; bonding solutions; chemical performance; conductive ground plane; consumer electronics; electromagnetic performance; far-field sources; high-technology shield; lightweight shields; low installation costs; low production costs; mechanical performance; minimum occupied volume; near field sources; nickel; printed-circuit boards; radiated emissions reduction; screening cover; shielding performance; tin; Bonding; Chemicals; Costs; Electromagnetic radiation; Electromagnetic shielding; Nickel; Production; Thermoforming; Tin; Transistors;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2002.1003401
