Electromagnetic performance of innovative lightweight shields to reduce radiated emissions from PCBs

Author

Sarto, Maria Sabrina ; Di Michele, Sergio ; Leerkamp, Peter

Author_Institution

Dept. of Electr. Eng., Univ. of Rome "La Sapienza", Italy

Volume

44

Issue

2

fYear

2002

fDate

5/1/2002 12:00:00 AM

Firstpage

353

Lastpage

363

Abstract

An innovative shielding concept to reduce radiated emissions from components and tracks on printed-circuit boards is proposed. The new shield is made of a polycarbonate foil, which is coated by a thin film of nickel (only 50 nm in thickness) and by a 5-μm thick layer of tin, and successively thermoformed. The innovative characteristics of such a high-technology shield are the extremely light weight, the high thermoformability, good shielding performance against both far-field and near field sources, low production costs, low installation costs, minimum occupied volume. The mechanical, chemical, and electromagnetic performance of the new shield has been characterized experimentally. Different bonding solutions are tested in order to optimize the shielding performance of the screening cover installed on a conductive ground plane

Keywords

conducting bodies; earthing; electromagnetic fields; electromagnetic interference; electromagnetic shielding; interference suppression; printed circuits; 5 micron; 50 nm; Ni; PCB; Sn; bonding solutions; chemical performance; conductive ground plane; consumer electronics; electromagnetic performance; far-field sources; high-technology shield; lightweight shields; low installation costs; low production costs; mechanical performance; minimum occupied volume; near field sources; nickel; printed-circuit boards; radiated emissions reduction; screening cover; shielding performance; tin; Bonding; Chemicals; Costs; Electromagnetic radiation; Electromagnetic shielding; Nickel; Production; Thermoforming; Tin; Transistors;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/TEMC.2002.1003401

Filename

1003401