DocumentCode
750485
Title
The benefits of stress testing
Author
Chan, H. Anthony
Author_Institution
AT&T Bell Labs., Princeton, NJ, USA
Volume
18
Issue
1
fYear
1995
fDate
3/1/1995 12:00:00 AM
Firstpage
23
Lastpage
29
Abstract
Weak products may exhibit failures or degrade only under certain stress conditions. Stress testing includes testing after stressing the incipient defects to hard defects and testing during stressing to show marginal defects, which are followed by root cause analysis and corrective actions. A given unit of a product has a probability of encountering a maximum stress X during its product life. It also has a probability of possessing a product yield strength Y, which is the maximum stress the unit ran survive without failure. A convenient picture is the contour map of the joint probability distribution of X and Y. Units in the Y<X region in this contour map will fail during the product life, whereas stress testing at a maximum stress level of X ST will capture the units in the Y<XST region. Therefore the lines X=Y and Y=XST divide the units into four regions, each with its cost and benefit from stress testing. The value of XST may be adjusted to vary the relative size of each region, and therefore to maximize the net benefit
Keywords
cost-benefit analysis; environmental stress screening; failure analysis; probability; benefit; contour map; cost; hard defects; joint probability distribution; marginal defects; product degradation; product failure; product life; product yield strength; stress testing; Acceleration; Degradation; Drives; Electronic switching systems; Life testing; Manufacturing processes; Probability distribution; Production facilities; Prototypes; Stress;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.370730
Filename
370730
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