Title :
Fine line circuit manufacturing technology with electroless copper plating
Author :
Akahoshi, Haruo ; Kawamoto, Mineo ; Itabashi, Takeyulu ; Miura, Osamu ; Takahashi, Akio ; Kobayashi, Shiro ; Miyazaki, Masashi ; Mutoh, Tsunefumi ; Wajima, Motoyo ; Ishimaru, Toshiaki
Author_Institution :
Res. Lab., Hitachi Ltd., Ibaraki, Japan
fDate :
3/1/1995 12:00:00 AM
Abstract :
Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here
Keywords :
adhesion; copper; electroless deposition; etching; fine-pitch technology; multichip modules; photolithography; printed circuit manufacture; thin film circuits; Cu; additive processes; electroless Cu plating; fabrication; fine circuit patterning; fine line circuit manufacturing technology; high-density circuits; Additives; Adhesives; Chemical technology; Circuits; Copper; Etching; Laminates; Manufacturing; Resists; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
