Title :
Intrinsic thermocouple monitor for laser wirebonding
Author :
Hussey, Brian W. ; Arjavalingam, G. ; Gupta, Arunava ; Chalco, Pedro A. ; Tong, H.
Author_Institution :
IBM Res., Yorktown Heights, NY, USA
fDate :
3/1/1995 12:00:00 AM
Abstract :
The use of the thermoelectric voltage generated between the tip and the wire during laser wirebonding is described as a process monitor. The change in thermoelectric response during melting of the wire is detected and used to control the laser pulselength. Thus, optimum bonding is achieved independent of thermal environment at different pad locations. The use of the process monitor for bonding on gold pads on multilayer alumina substrates is described in detail
Keywords :
BASIC listings; computerised monitoring; electric sensing devices; feedback; laser beam welding; lead bonding; optical fibres; optical variables control; process control; signal processing equipment; thermocouples; thermoelectric devices; Au pads; Au-Al2O3; intrinsic thermocouple monitor; laser pulselength; laser wirebonding; multilayer alumina substrates; optimum bonding; process monitor; thermoelectric response; Bonding; Gold; Laser transitions; Monitoring; Nonhomogeneous media; Optical control; Optical pulses; Thermoelectricity; Voltage; Wire;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
