Title :
Compact 90° Releasable Multifiber Optical Connectivity Solution
Author :
Krahenbuhl, Roger ; Kunde, Jens ; Pliska, Anne-Claire ; Bauknecht, Raimond ; Bosshard, Christian
Author_Institution :
Huber+Suhner AG, Herisau
fDate :
4/15/2007 12:00:00 AM
Abstract :
A compact releasable 90deg optical connectivity solution is proposed, realized, and characterized. It can be used for angled interconnection between two small form factor multifiber connectors, or between one connector and surface mounted multichannel active optical elements such as vertical-cavity surface-emitting lasers and photodetector arrays. This 90deg connectivity system is based on V-groove substrates and an integrated optical microsystem combining two lens arrays and a 45deg mirror. Realized modules feature average fiber-to-fiber optical losses of 1.4 dB (best below 1 dB) for multimode operation over the whole wavelength range from 850 up to 1550 nm. This interconnect solution provides advantages when limited space is available (e.g., in optical distribution frames, splice closures, high-performance computers)
Keywords :
integrated optics; microlenses; micromirrors; optical arrays; optical communication equipment; optical fibre communication; optical fibre losses; optical interconnections; surface mount technology; 45deg mirror; 850 to 1550 nm; 90deg optical connectivity solution; V-groove substrates; angled interconnection; fiber-to-fiber optical losses; integrated optical microsystem; lens arrays; multichannel active optical elements; multifiber connectors; multifiber optical connectivity solution; multimode operation; photodetector arrays; releasable optical connectivity solution; surface mounted optical elements; vertical-cavity surface-emitting lasers; Connectors; Fiber lasers; Integrated optics; Lenses; Optical arrays; Optical interconnections; Optical surface waves; Photodetectors; Surface emitting lasers; Vertical cavity surface emitting lasers; Optical arrays; optical fiber communication; optical fiber connecting; optical interconnections; packaging;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2007.894277