Title :
Assembly and Electrical Characterization of Multiwall Carbon Nanotube Interconnects
Author :
Close, Gael F. ; Wong, H-S Philip
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA
Abstract :
We demonstrate a general method to assemble and contact arrays of individual multiwall carbon nanotube (MWCNT) interconnects between electrodes in one batch. We have also collected about 200 resistance measurements to compare four different contact metals: Al, Au, Ti, and Pd. We have also measured the radio frequency characteristics of the assembled MWCNTs up to 15 GHz. High-resolution transmission electron microscopy analysis has been used to correlate the electrical and physical characteristics of the MWCNTs.
Keywords :
aluminium; carbon nanotubes; contact resistance; gold; integrated circuit interconnections; palladium; titanium; transmission electron microscopy; Al; Au; C; Pd; Ti; electrodes; high-resolution transmission electron microscopy; multiwall carbon nanotube interconnects; radio frequency characteristics; Carbon Nanotube; Carbon nanotube; Interconnects; Nano-fabrication; Nanoelectronics; interconnects; nanoelectronics; nanofabrication;
Journal_Title :
Nanotechnology, IEEE Transactions on
DOI :
10.1109/TNANO.2008.927373
