DocumentCode :
750991
Title :
High-voltage (3 kV) UMOSFETs in 4H-SiC
Author :
Li, Y. ; Cooper, J.A., Jr. ; Capano, M.A.
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
49
Issue :
6
fYear :
2002
fDate :
6/1/2002 12:00:00 AM
Firstpage :
972
Lastpage :
975
Abstract :
Vertical trench-gate metal-oxide-semiconductor field-effect transistors (UMOSFETs) in 4H-SiC having both trench oxide protection and junction termination extension (JTE) are reported for the first time. Devices are fabricated with and without counter-doped channels. Blocking voltages and specific on-resistances are 3360 V and 199 mΩ-cm2 for doped-channel FETs and 3055 V and 121 mΩ-cm2 for FETs without doped channels. These blocking voltages are the highest reported to date for UMOSFETs in SiC
Keywords :
isolation technology; leakage currents; power MOSFET; silicon compounds; sputter etching; wide band gap semiconductors; 3 kV; SiC; UMOSFET; blocking voltages; counter-doped channels; ionization coefficients; junction termination extension; on-state characteristics; reactive ion etching; reverse leakage current density; specific on-resistances; trench oxide protection; vertical trench-gate MOSFET; FETs; Implants; MOSFET circuits; Power MOSFET; Protection; Silicon carbide; Temperature; Termination of employment; Voltage; Wideband;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2002.1003714
Filename :
1003714
Link To Document :
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