A novel geometry for circular series connected multilevel inductors for CMOS RF integrated circuits

Author

Aguilera, Jaime ; Meléndez, Juan ; Berenguer, Roc ; Sendra, José Ramón ; Hernandez, A. ; del Pino, Javier

Author_Institution

Escuela Superior de Ingenieros, San Sebastian, Spain

Volume

49

Issue

6

fYear

2002

fDate

6/1/2002 12:00:00 AM

Firstpage

1084

Lastpage

1086

Abstract

The scope of this brief is to introduce a novel geometry for circular series connected multilevel inductors. The idea is to improve the overlapping of the different metal layers that form the integrated inductor to maximize the magnetic flux shared by them and so the inductance. The performance of this new geometry has been compared with the conventional one, using Agilent HFSS field solver. After that, two multilevel inductors using this new geometry have been fabricated in a standard 0.6 μm three-metal CMOS process and measured

Keywords

CMOS analogue integrated circuits; Q-factor; UHF integrated circuits; circuit simulation; field effect MMIC; inductors; integrated circuit interconnections; integrated circuit layout; Agilent HFSS field solver; CMOS RF integrated circuits; circular series connected; electromagnetic simulations; integrated inductor; magnetic flux; metal layers overlapping; multilevel inductors; quality factors; three-metal CMOS process; CMOS integrated circuits; CMOS process; CMOS technology; Geometry; Inductors; Integrated circuit yield; Microwave devices; Power measurement; Radio frequency; Radiofrequency integrated circuits;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2002.1003756

Filename

1003756