DocumentCode :
751402
Title :
Influence of bending-extension coupling on the modal frequencies of nonsymmetrically laminated MEMS microcantilevers
Author :
Gibson, Ronald F. ; Liu, Zhengyu ; Srinivasan, Niranjan
Author_Institution :
Mech. Eng. Dept., Wayne State Univ., Detroit, MI, USA
Volume :
14
Issue :
6
fYear :
2005
Firstpage :
1236
Lastpage :
1243
Abstract :
Many microelectromechanical systems (MEMS) devices are based on some aspect of the modal vibration response of microcantilever beams, and these microcantilevers often have nonsymmetrically laminated construction. Such construction can lead to complex mechanical coupling effects which are not included in elementary beam theory, yet this theory is often used to estimate the modal frequencies of microcantilevers. In this paper, the bending-extension coupling effects on the modal frequencies of a typical two-layer microcantilever beam element in a MEMS chemical sensor are analyzed. Classical Lamination Theory is combined with a Rayleigh-Ritz analysis to develop a model for the modal frequencies of this microcantilever. Results are compared with those from the elementary beam theory and a finite element model. Bending-extension coupling effects are found to depend on the beam length-to-thickness ratio, on the coating thickness-to-beam thickness ratio, and on the mode number. [1369].
Keywords :
Rayleigh-Ritz methods; cantilevers; chemical sensors; laminates; microsensors; modal analysis; vibrations; MEMS microcantilevers; Rayleigh-Ritz analysis; bending-extension coupling; chemical sensor; elementary beam theory; finite element model; lamination theory; mechanical coupling effects; microcantilever beams; modal frequency; modal vibration response; nonsymmetrically laminated construction; Chemical analysis; Chemical elements; Chemical sensors; Frequency estimation; Lamination; Microelectromechanical systems; Micromechanical devices; Optical coupling; Structural beams; Vibrations; Microelectromechanical devices; modeling; vibrations;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2005.859078
Filename :
1549858
Link To Document :
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