• DocumentCode
    751408
  • Title

    Power conscious CAD tools and methodologies: a perspective

  • Author

    Singh, Deo ; Rabaey, Jan M. ; Pedram, Massoud ; Catthoor, Francky ; Rajgopal, Suresh ; Sehgal, Naresh ; Mozdzen, Thomas J.

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • Volume
    83
  • Issue
    4
  • fYear
    1995
  • fDate
    4/1/1995 12:00:00 AM
  • Firstpage
    570
  • Lastpage
    594
  • Abstract
    Power consumption is rapidly becoming an area of growing concern in IC and system design houses. Issues such as battery life, thermal limits, packaging constraints and cooling options are becoming key factors in the success of a product. As a consequence, IC and system designers are beginning to see the impact of power on design area, design speed, design complexity and manufacturing cost. While process and voltage scaling can achieve significant power reductions, these are expensive strategies that require industry momentum, that only pay off in the long run. Technology independent gains for power come from the area of design for low power which has a much higher return on investment (ROI). But low power design is not only a new area but is also a complex endeavour requiring a broad range of synergistic capabilities from architecture/microarchitecture design to package design. It changes traditional IC design from a two-dimensional problem (Area/performance) to a three-dimensional one (Area/Performance/Power). This paper describes the CAD tools and methodologies required to effect efficient design for low power. It is targeted to a wide audience and tries to convey an understanding of the breadth of the problem. It explains the state of the art in CAD tools and methodologies. The paper is written in the form of a tutorial, making it easy to read by keeping the technical depth to a minimum while supplying a wealth of technical references. Simultaneously the paper identifies unresolved problems in an attempt to incite research in these areas. Finally an attempt is made to provide commercial CAD tool vendors with an understanding of the needs and time frames for new CAD tools supporting low power design
  • Keywords
    circuit CAD; cooling; design for manufacture; integrated circuit design; integrated circuit packaging; CAD tools; IC design; battery life; cooling options; design area; design complexity; design speed; low power design; manufacturing cost; packaging constraints; power consumption; return on investment; thermal limits; tool vendors; Batteries; Cooling; Costs; Design automation; Energy consumption; Manufacturing; Packaging; Rapid thermal processing; Thermal factors; Voltage;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.371967
  • Filename
    371967