DocumentCode
751529
Title
An experimental study of sidewall adhesion in microelectromechanical systems
Author
Timpe, Shannon J. ; Komvopoulos, Kyriakos
Author_Institution
Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
Volume
14
Issue
6
fYear
2005
Firstpage
1356
Lastpage
1363
Abstract
A surface micromachine was designed specifically for studying sidewall adhesion in microelectromechanical systems (MEMS). The dependence of surface adhesion on contact load and ambient conditions was investigated under quasistatic normal loading conditions. Insight was obtained into the relative contributions of van der Waals and capillary forces to the measured adhesion force. Several shortcomings in previous adhesion studies of MEMS were overcome, and measurement of the true adhesion force was achieved under different testing conditions. The present experimental procedure enables the isolation of the van der Waals component of the adhesion force and the determination of the contributions of both contacting and noncontacting asperities to the total adhesion force at the inception of surface separation. The major benefits of the developed experimental methodology and surface micromachine are discussed in the context of adhesion results obtained for different values of apparent contact pressure, ambient pressure, and relative humidity.
Keywords
adhesion; capillarity; micromachining; micromechanical devices; stiction; van der Waals forces; adhesion force; capillary forces; microelectromechanical systems; sidewall adhesion; surface adhesion; surface micromachine; surface separation; van der Waals forces; Adhesives; Force measurement; Humidity; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Microstructure; Rough surfaces; Surface cracks; Surface topography; Adhesion; ambient pressure; capillary forces; contact pressure; microelectromechanical devices; relative humidity; stiction; van der Waals forces;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2005.859076
Filename
1549870
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