DocumentCode :
751560
Title :
Fluid flows in microchannels with cavities
Author :
Yu, Zeta Tak For ; Lee, Yi-Kuen ; Wong, Man ; Zohar, Yitshak
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China
Volume :
14
Issue :
6
fYear :
2005
Firstpage :
1386
Lastpage :
1398
Abstract :
Pressure-driven gas and liquid flows through microchannels with cavities have been studied using both experimental measurements and numerical computations. Several microchannels with cavities varying in shape, number and dimensions have been fabricated. One set of microdevices, integrated with sensors on a silicon wafer, is used for flow rate and pressure distribution measurements in gas flows. Another set of microdevices, fabricated using glass-to-silicon wafer bonding, is utilized for visualization of liquid flow patterns. The cavity effect on the flow in the microchannel is found to be very small, with the mass flow rate increasing slightly with increasing number of cavities. The flow pattern in the cavity depends on two control parameters; it is fully attached only if both the reduced Reynolds number and the cavity number are small. A flow regime map has been constructed, where the critical values for the transition from attached to separated flow are determined. The numerical computations reveal another control parameter, the cavity aspect ratio. The flow in the cavity is similar only if all three control parameters are the same. Finally, the vorticity distribution and related circulation in the cavity are analyzed. [1546].
Keywords :
flow visualisation; microchannel flow; microsensors; Reynolds number; cavity number; flow rate distribution measurements; fluid flows; gas flows; liquid flow; micro vortex; microcavity flow; microchannels; microdevices; microscale flow separation; pressure distribution measurements; silicon wafer; vorticity distribution; wafer bonding; Fluid flow; Fluid flow control; Fluid flow measurement; Gas detectors; Mechanical engineering; Microchannel; Pressure measurement; Shape; Silicon; Wafer bonding; Microcavity flow; micro vortex; microscale flow separation; reduced Reynolds number;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2005.859086
Filename :
1549873
Link To Document :
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