• DocumentCode
    751766
  • Title

    Thermal bubble motion in liquid nitrogen under nonuniform electric fields

  • Author

    Wang, P. ; Swaffield, D.J. ; Lewin, P.L. ; Chen, G.

  • Author_Institution
    Tony Davies High Voltage Lab., Univ. of Southampton, Southampton
  • Volume
    15
  • Issue
    3
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    626
  • Lastpage
    634
  • Abstract
    This paper describes an experimental study into the influence of a non-uniform electric field on bubble motion and behavior in liquid nitrogen. The electric field effect on bubble motion as it rises due to buoyancy within applied dc electric fields is quantitatively investigated using a rod-plane gap. Thermal bubble motion and bubble collision with the plane electrode processes were observed in these experiments. The experimental results show that dc non-uniform electric fields have an obvious effect on bubble behavior; bubbles move closer to the plane electrode away from a higher field region to a lower one, irrespective of electric field direction. A model based on analysis of the forces acting on the bubble has been developed. This set of differential equations describes the motion of a spherical bubble in the rod-plane gap with voltage and can be solved numerically to determine bubble trajectory. Compared to experimental data, the theoretical prediction is in very good agreement.
  • Keywords
    bubbles; dielectric liquids; electric field effects; high-temperature superconductors; nitrogen; bubble collision; electric field effect; liquid nitrogen; nonuniform electric field; thermal bubble motion; Breakdown voltage; Cryogenics; Dielectric liquids; Dielectrics and electrical insulation; Electric breakdown; Electric fields; Electrodes; High temperature superconductors; Nitrogen; Nonuniform electric fields;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2008.4543098
  • Filename
    4543098