• DocumentCode
    751962
  • Title

    Theoretical correlations amongst electrical and mechanical characteristics of polymeric housing materials for outdoor insulators

  • Author

    Prabu, R. Raja ; Usa, S. ; Udayakumar, K. ; Khan, M. Abdullah ; Majeed, S. S M Abdul

  • Author_Institution
    B.S.A Crescent Eng. Coll., Chennai
  • Volume
    15
  • Issue
    3
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    771
  • Lastpage
    782
  • Abstract
    In this paper, theoretical correlation amongst various electrical characteristics of a housing / weather shed material is attempted. Also, a correlation relating tensile strength (a mechanical property) to insulation characteristics is proposed. The housing material used, is made of polymeric blends (Silicone/EPDM) with and without fillers (silica and alumina trihydrate).The proposed correlation is obtained through Dimensional Analysis technique. An attempt is also made to provide qualitative interpretations for these relationships, based on the fundamental physical quantities. Multivariate regression analysis of experimental values of the dependent and independent variables, that figure in these correlations is carried out. It yielded almost the same values for the exponents as those in the correlations developed using dimensional analysis. This confirmed similar quantitative and qualitative influences of various insulation parameters on tracking resistance and tensile strength, as predicted by the dimensional analysis approach.
  • Keywords
    correlation methods; polymer blends; polymer insulators; regression analysis; tensile strength; correlations; dimensional analysis; electrical characteristics; mechanical characteristics; multivariate regression analysis; outdoor insulators; polymeric blends; polymeric housing materials; silicone/EPDM; tensile strength; Dielectrics and electrical insulation; Educational institutions; Electric variables; Insulation life; Mechanical factors; Plastic insulation; Polymers; Silicon compounds; Surface resistance; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2008.4543115
  • Filename
    4543115