DocumentCode
751962
Title
Theoretical correlations amongst electrical and mechanical characteristics of polymeric housing materials for outdoor insulators
Author
Prabu, R. Raja ; Usa, S. ; Udayakumar, K. ; Khan, M. Abdullah ; Majeed, S. S M Abdul
Author_Institution
B.S.A Crescent Eng. Coll., Chennai
Volume
15
Issue
3
fYear
2008
fDate
6/1/2008 12:00:00 AM
Firstpage
771
Lastpage
782
Abstract
In this paper, theoretical correlation amongst various electrical characteristics of a housing / weather shed material is attempted. Also, a correlation relating tensile strength (a mechanical property) to insulation characteristics is proposed. The housing material used, is made of polymeric blends (Silicone/EPDM) with and without fillers (silica and alumina trihydrate).The proposed correlation is obtained through Dimensional Analysis technique. An attempt is also made to provide qualitative interpretations for these relationships, based on the fundamental physical quantities. Multivariate regression analysis of experimental values of the dependent and independent variables, that figure in these correlations is carried out. It yielded almost the same values for the exponents as those in the correlations developed using dimensional analysis. This confirmed similar quantitative and qualitative influences of various insulation parameters on tracking resistance and tensile strength, as predicted by the dimensional analysis approach.
Keywords
correlation methods; polymer blends; polymer insulators; regression analysis; tensile strength; correlations; dimensional analysis; electrical characteristics; mechanical characteristics; multivariate regression analysis; outdoor insulators; polymeric blends; polymeric housing materials; silicone/EPDM; tensile strength; Dielectrics and electrical insulation; Educational institutions; Electric variables; Insulation life; Mechanical factors; Plastic insulation; Polymers; Silicon compounds; Surface resistance; Thermal conductivity;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2008.4543115
Filename
4543115
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