High-power magnetron Cu seed deposition on 3-D dual inlaid features

Cu seed deposition is an important step before electroplating when filling trenches and vias for interconnect manufacture. An integrated reactor to feature scale model has been applied to a high-power magnetron (HPM) source for Cu seed deposition. Images of the resulting Cu seed coverage on a canonical dual inlaid feature using the HPM source are presented. The dominant deposition species is the Cu athermal, which has a broad angular distribution. The deposition results predict rounded profiles and via bottom and cusp formation at trench and via tops due to geometric shadowing of the Cu athermals