DocumentCode :
753430
Title :
Plasma impedance in a narrow gap capacitively coupled RF discharge
Author :
Bera, Kallol ; Chen, Chen-An ; Vitello, Peter
Author_Institution :
Appl. Mater. Inc., Santa Clara, CA, USA
Volume :
30
Issue :
1
fYear :
2002
fDate :
2/1/2002 12:00:00 AM
Firstpage :
144
Lastpage :
145
Abstract :
Capacitively coupled reactors with narrow gap spacings are extensively used for plasma enhanced chemical vapor deposition (PECVD) processes in the semiconductor industry. An understanding of the plasma impedance is important for efficient coupling of the source power to the plasma. The plasma impedance can change based on operating conditions as the structure of the discharge changes. The plasma impedance and power requirement are calculated for different RF potential. Images of the electron density distribution, and the electron and ion density profiles in the well-resolved sheath are also presented to provide better insight of the plasma behavior
Keywords :
electron density; high-frequency discharges; plasma CVD; plasma density; plasma sheaths; semiconductor technology; RF potential; capacitively coupled reactors; electron density distribution; electron density profiles; ion density profiles; narrow gap capacitively coupled RF discharge; narrow gap spacings; plasma behavior; plasma enhanced chemical vapor position; plasma impedance; semiconductor industry; sheath; Electrons; Fault location; Impedance; Inductors; Plasma applications; Plasma chemistry; Plasma density; Plasma sheaths; Plasma sources; Radio frequency;
fLanguage :
English
Journal_Title :
Plasma Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-3813
Type :
jour
DOI :
10.1109/TPS.2002.1003965
Filename :
1003965
Link To Document :
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