• DocumentCode
    75379
  • Title

    High Fill-Factor Substrate-Based Wire-Grid Polarizers With High Extinction Ratios

  • Author

    Middendorf, J.R. ; Cetnar, J.S. ; Owsley, Jack ; Brown, E.R.

  • Author_Institution
    Dept. of Phys., Wright State Univ., Dayton, OH, USA
  • Volume
    4
  • Issue
    3
  • fYear
    2014
  • fDate
    May-14
  • Firstpage
    376
  • Lastpage
    382
  • Abstract
    Low-cost, substrate-based, millimeter-wave-to-THz wire-grid polarizers have been fabricated on crystalline-quartz substrates using planar processing techniques. The polarizers achieve high extinction ratios (at least 60 dB) with a single layer, while maintaining low insertion loss (a few decibels) by taking advantage of previously under-utilized “spoof” surface-plasmon effects. Full-wave finite-element simulations done with High Frequency Structure Simulator and experiments both show that metal fill-factors upwards of 90% greatly improve polarizer extinction ratio. The extinction ratio of high fill-factor polarizers exceeds that of a commercial free-standing wire grid by up to 20 dB at normal incidence.
  • Keywords
    electromagnetic wave polarisation; finite element analysis; frequency selective surfaces; millimetre wave devices; surface plasmons; terahertz wave devices; wires (electric); commercial free-standing wire grid; crystalline-quartz substrates; full-wave finite-element simulations; high extinction ratios; high fill-factor substrate-based wire-grid polarizers; high frequency structure simulator; low insertion loss; low-cost wire-grid polarizers; millimeter-wave-to-THz wire-grid polarizers; planar processing techniques; polarizer extinction ratio; spoof surface-plasmon effects; substrate-based wire-grid polarizers; Aluminum; Extinction ratio; Fabrication; Strips; Substrates; Wires; Extinction ratio; THz; fill-factor (FF); millimeter wave (MMW); polarizer; surface plasmon; wire grid;
  • fLanguage
    English
  • Journal_Title
    Terahertz Science and Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-342X
  • Type

    jour

  • DOI
    10.1109/TTHZ.2014.2313959
  • Filename
    6787031