• DocumentCode
    754095
  • Title

    A 1 V 23 GHz Low-Noise Amplifier in 45 nm Planar Bulk-CMOS Technology With High- Q Above-IC Inductors

  • Author

    Wang, Wen-Chieh ; Huang, Zue-Der ; Carchon, Geert ; Mercha, Abdelkarim ; Decoutere, Stefaan ; De Raedt, Walter ; Wu, Chung-Yu

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu
  • Volume
    19
  • Issue
    5
  • fYear
    2009
  • fDate
    5/1/2009 12:00:00 AM
  • Firstpage
    326
  • Lastpage
    328
  • Abstract
    A 23 GHz electrostatic discharge-protected low-noise amplifier (LNA) has been designed and implemented by 45 nm planar bulk-CMOS technology with high-Q above-IC inductors. In the designed LNA, the structure of a one-stage cascode amplifier with source inductive degeneration is used. All high-Q above-IC inductors have been implemented by thin-film wafer-level packaging technology. The fabricated LNA has a good linearity where the input 1 dB compression point (IP-1dB ) is -9.5 dBm and the input referred third-order intercept point ( PIIP3 ) is + 2.25 dBm. It is operated with a 1 V power supply drawing a current of only 3.6 mA. The fabricated LNA has demonstrated a 4 dB noise figure and a 7.1 dB gain at the peak gain frequency of 23 GHz, and it has the highest figure-of-merit. The experimental results have proved the suitability of 45 nm gate length bulk-CMOS devices for RF ICs above 20 GHz.
  • Keywords
    CMOS integrated circuits; MMIC amplifiers; electrostatic discharge; inductors; low noise amplifiers; wafer level packaging; RF IC; current 3.6 mA; electrostatic discharge-protected LNA; frequency 23 GHz; gain 7.1 dB; high-Q above-IC inductor; low-noise amplifier; noise figure 4 dB; one-stage cascode amplifier; planar bulk-CMOS technology; size 45 nm; source inductive degeneration; thin-film wafer-level packaging technology; voltage 1 V; 45 nm; CMOS; K -band; electrostatic discharge (ESD) protection; low-noise amplifier (LNA);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2009.2017611
  • Filename
    4840599