DocumentCode :
75428
Title :
A 3-D Near-Field Modeling Approach for Electromagnetic Interference Prediction
Author :
Shall, H. ; Riah, Z. ; Kadi, Moncef
Author_Institution :
Res. Inst. for Embedded Syst., St. Étienne du Rouvray, France
Volume :
56
Issue :
1
fYear :
2014
fDate :
Feb. 2014
Firstpage :
102
Lastpage :
112
Abstract :
This paper presents, through an illustrative example, a 3-D modeling approach to predict the electromagnetic interference (EMI) between complex electronic devices and interconnections placed in the near-field region. Three different analytic coupling formulations have been investigated along with a 3-D-emission model to evaluate the induced voltages in transmission line (TL) extremities in the case of both matched and mismatched TL configurations. The proposed modeling method is successfully validated by comparison with numerical results using electromagnetic (EM) simulation tools and experimental results using near-field measurement. The obtained EM coupling results are more accurate than other traditional 2-D models.
Keywords :
electromagnetic interference; electronic engineering computing; solid modelling; transmission lines; 3D near-field modeling approach; 3D-emission model; EM coupling results; EMI; complex electronic devices; complex interconnections; electromagnetic interference prediction; electromagnetic simulation tools; induced voltage evaluation; matched TL configurations; mismatched TL configurations; near-field measurement; transmission line; Antenna measurements; Couplings; Integrated circuit modeling; Numerical models; Probes; Solid modeling; Transmission line measurements; 3-D-emission model; Analytic coupling formulations; near-field measurement; transmission lines (TL);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2013.2274576
Filename :
6576152
Link To Document :
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