• DocumentCode
    754687
  • Title

    Engineering Your Future [Schoch´s Review]

  • Author

    Walesh, Stuart G.

  • Volume
    12
  • Issue
    1
  • fYear
    1996
  • Firstpage
    41
  • Keywords
    Books; Chip scale packaging; Electronics packaging; Engineering management; Engineering profession; Ethics; Humans; Management training; Manufacturing; Writing;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.1996.484114
  • Filename
    484114