Ultra-thin pocket embedding package for system in package

Proposed is a new type of packaging technology, `pocket embedding package´, using selectively anodised aluminium substrate. In this technology, chips can be embedded inside aluminium substrate so that an ultra-thin and compact type of package can be achieved. A monolithic microwave integrated circuit dice with 120 mum thickness has been successfully embedded inside the substrate with a tolerance of less than 5 mum, and 300 mum of total thickness can be achieved with excellent thermal dissipation