Title :
A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package
Author :
Nakazawa, Tsutomu ; Inoue, Yumi ; Sawada, Kanako ; Sudo, Toshio
Author_Institution :
Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
fDate :
1/1/1996 12:00:00 AM
Abstract :
A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of 0.45 mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of a crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin
Keywords :
cracks; deformation; integrated circuit packaging; lead bonding; plastic packaging; reflow soldering; shear strength; stress effects; 240 C; chip side support package; crack-free plastic package; design criteria; mold resin; reflow soldering process; shear strength; shear stress; Adhesives; Bonding; Cascading style sheets; Delamination; Equations; Moisture; Plastic packaging; Reflow soldering; Resins; Thermal stresses;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
DOI :
10.1109/3476.484206
