• DocumentCode
    75548
  • Title

    A Three-Dimensional HIE-PSTD Scheme for Simulation of Thin Slots

  • Author

    Juan Chen ; Jianguo Wang

  • Author_Institution
    Key Lab. for Phys. Electron. & Devices of the Minist. of Educ., Xi´an Jiaotong Univ., Xi´an, China
  • Volume
    55
  • Issue
    6
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    1239
  • Lastpage
    1249
  • Abstract
    In this paper, a pseudospectral (PS) scheme is introduced into the hybrid implicit-explicit finite-difference time-domain (HIE-FDTD) method for solving the shielding effectiveness (SE) of thin slots. The maximum time-step size in this method is only determined by two spatial discretizations and the spatial discretization only needs two cells per wavelength. The 3-D formula of the method is presented and the time stability condition of the method is demonstrated. When this method is applied to simulate thin slots, high computational efficiency is obtained and less computer memory is used, which is demonstrated through numerical examples by comparing with the finite-difference time-domain (FDTD) method, HIE-FDTD method, and alternating-direction implicit (ADI)-FDTD method.
  • Keywords
    electromagnetic shielding; finite difference time-domain analysis; 3-D formula; ADI-FDTD method; HIE-FDTD method; alternating-direction implicit method; computational efficiency; computer memory; finite-difference time-domain method; hybrid implicit-explicit finite-difference time-domain method; maximum time-step size; pseudospectral scheme; shielding effectiveness; spatial discretizations; thin slots simulation; three-dimensional HIE-PSTD scheme; time stability condition; Computers; Equations; Finite difference methods; Fourier transforms; Numerical stability; Solid modeling; Time-domain analysis; Conditional stability; FDTD; HIE-FDTD; thin slot;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2013.2265037
  • Filename
    6576163