DocumentCode :
755768
Title :
Design optimization methodology for deep-submicrometer CMOS device at low-temperature operation
Author :
Kakumu, Masakazu ; Peters, Dan W. ; Liu, Hua-Yu ; Chiu, Kuang-Yi
Author_Institution :
Toshiba Corp., Kawasaki, Japan
Volume :
39
Issue :
2
fYear :
1992
fDate :
2/1/1992 12:00:00 AM
Firstpage :
370
Lastpage :
378
Abstract :
The design optimization for 0.3-μm channel CMOS technology at liquid-nitrogen temperature (77 K) is described. The tradeoff between circuit performance and reliability for deep-submicrometer CMOS devices at low-temperature operation is theoretically and experimentally examined. A simulator, which selects power-supply voltage and process/device parameters for low-temperature operation, has been developed. Based upon the simulated results, design optimization for low-temperature operation has been proposed to determine power-supply voltage and various process and device parameters. The optimized design has been demonstrated on a 0.3-μm CMOS device, by utilizing electron beam (EB) lithography· Excellent device characteristics and a functional ring oscillator circuit have been obtained at 77 K
Keywords :
CMOS integrated circuits; electron beam lithography; integrated circuit technology; integrated logic circuits; optimisation; oscillators; 0.3 micron; 77 K; circuit performance; deep-submicrometer CMOS devices; design optimisation methodology; device characteristics; device parameters; electron lithography; logic gates; low-temperature operation; power-supply voltage; process parameters; reliability; ring oscillator circuit; tradeoff; CMOS technology; Circuit optimization; Circuit simulation; Design optimization; Guidelines; Laboratories; Power supplies; Reliability theory; Temperature; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.121696
Filename :
121696
Link To Document :
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