DocumentCode
755806
Title
Efficient light scattering modeling for alignment, metrology, and resist exposure in photolithography
Author
Yuan, Chi-Min
Author_Institution
IBM East Fishkill Facility, Hopewell Junction, NY, USA
Volume
39
Issue
7
fYear
1992
fDate
7/1/1992 12:00:00 AM
Firstpage
1588
Lastpage
1598
Abstract
In previous work, a two-dimensional waveguide model has been developed and examined extensively so that rigorous light scattering calculations for photolithography-related processes, such as stepper alignment, linewidth and overlay measurements, and resist bleaching, can be performed. The computation, however, is expensive if the wafer topography involved is complicated or if resist bleaching problems are involved. Numerical techniques that reduce CPU usage by approximately an order of magnitude are reported. These techniques make the waveguide model more practical to use. Typically, for each polarization state, it takes 10 to 200 s to simulate a static case (e.g. linewidth measurement), and it is projected that it will take 7 to 70 min to simulate a dynamic case (e.g. resist bleaching under 13 incoherent illumination point sources and ten exposure steps) on a high-speed workstation such as an IBM RISC/6000 Model 530
Keywords
light scattering; photolithography; GaAs; III-V semiconductors; alignment; dynamic case; high-speed workstation; incoherent illumination point sources; light scattering calculations; linewidth; linewidth measurement; metrology; overlay measurements; photolithography; resist bleaching; resist exposure; static case; stepper alignment; wafer topography; Bleaching; Light scattering; Lighting; Metrology; Performance evaluation; Polarization; Resists; Semiconductor device modeling; Surfaces; Workstations;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.141223
Filename
141223
Link To Document