DocumentCode :
755867
Title :
Guest Editorial
Author :
Tomaki, Y.
Volume :
9
Issue :
1
fYear :
1996
Firstpage :
1
Keywords :
Capacitance; Circuit testing; Electric variables measurement; Failure analysis; Grain boundaries; Integrated circuit interconnections; Materials reliability; Materials testing; Microelectronics; Process control;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.1996.484275
Filename :
484275
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=755867
