• DocumentCode
    755903
  • Title

    A model too hot to handle? [MOSFET model]

  • Author

    Fossum, Jerry G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    18
  • Issue
    3
  • fYear
    2002
  • fDate
    5/1/2002 12:00:00 AM
  • Firstpage
    26
  • Lastpage
    31
  • Abstract
    The physics/process-based UFPDB compact model, unified for PDSOI and bulk-Si MOSFETs, has been overviewed. Its truly physical nature was exemplified, and the afforded straightforward evaluation of its single small set of parameters, based on device structure, was discussed. Its predictive capability was demonstrated for devices and circuits, the latter via UFPDB/Spice3 ring-oscillator simulations that benchmarked scaled PDSOI and bulk-Si CMOS technologies, projecting a sustained performance advantage for the former as the devices are scaled to their limit near Lgate=60 nm. Based on the author´s development and applications of UFPDB, it is strongly believed that this truly physics-based compact MOSFET model can and should replace the empirical standard, for PDSOI and bulk-Si CMOS at present, and perhaps in the future for fully depleted SOI and double-gate devices
  • Keywords
    CMOS integrated circuits; MOSFET; SPICE; circuit CAD; circuit simulation; semiconductor device models; silicon-on-insulator; 60 nm; CAD; CMOS circuit simulation; PDSOI MOSFETs; Si-SiO2; UFPDB/Spice3 ring-oscillator simulations; bulk-Si CMOS technologies; bulk-Si MOSFETs; device scaling; double-gate devices; fully depleted SOI devices; model parameter set; performance advantage; physical MOSFET model; physics-based compact MOSFET model; physics/process-based UFPDB compact model; predictive capability; scaled PDSOI CMOS technologies; CMOS technology; Circuit simulation; Impact ionization; Integrated circuit modeling; MOSFET circuits; Nonlinear equations; Partial discharges; Physics; Semiconductor device modeling; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.2002.1005646
  • Filename
    1005646