DocumentCode
755965
Title
InGaAs field-effect transistors with submicron gates for K -band applications
Author
Johnson, Gregory A. ; Kapoor, Vik J. ; Schmitz, Dietmar ; Jurgensen, Holger
Author_Institution
Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Volume
40
Issue
3
fYear
1992
fDate
3/1/1992 12:00:00 AM
Firstpage
429
Lastpage
433
Abstract
Depletion mode InGaAs microwave power MISFETs with 0.7 μm gate lengths and 0.2 mm gate widths have been fabricated using an epitaxial process. The devices employed a plasma deposited silicon dioxide gate insulator. The RF power performance at 18 GHz, 20 GHz, and 23 GHz is presented. An output power density of 1.04 W/mm with a corresponding power gain and power-added efficiency of 3.7 dB and 40%, respectively, was obtained at 18 GHz. This is the highest output power density obtained for an InGaAs based transistor on InP at K -band. Record output power densities for an InGaAs MISFET were also demonstrated to the stable within 3% over 17 hours of continuous operation at 18 GHz
Keywords
III-V semiconductors; gallium arsenide; indium compounds; insulated gate field effect transistors; power transistors; solid-state microwave devices; 0.2 mm; 0.7 micron; 18 to 23 GHz; 3.7 dB; 40 percent; InGaAs; InP; K-band applications; RF power performance; SHF; depletion mode; epitaxial process; field-effect transistors; microwave power MISFETs; plasma deposited SiO2 gate insulator; power-added efficiency; submicron gates; FETs; Indium gallium arsenide; Insulation; MISFETs; Microwave devices; Plasma density; Plasma devices; Power generation; Radio frequency; Silicon compounds;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.121717
Filename
121717
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