• DocumentCode
    755988
  • Title

    Improvements in Cpk using real-time feedback control

  • Author

    El-Awady, Khalid ; Schaper, Charles ; Kailath, Thomas

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., CA, USA
  • Volume
    9
  • Issue
    1
  • fYear
    1996
  • fDate
    2/1/1996 12:00:00 AM
  • Firstpage
    87
  • Lastpage
    94
  • Abstract
    The usual approach to bring the value of the process capability index, Cpk, to an acceptable level is to design equipment and develop a process in which the process variable is robust to external disturbances. However, an alternative approach involves the use of in situ sensors and real-time feedback control. Currently this approach is not widely implemented in the semiconductor industry. In this paper we provide analytic justification to quantify the potential improvement in Cpk if a real-time feedback control scheme is used instead of the usual open-loop approach. We show that for the case of feedback control the level of Cpk is only limited by the accuracy and reproducibility of the sensor provided that the target values are indeed achievable by the processing equipment. This result also holds in the presence of disturbances and nonlinearities. Cpk values for open-loop and real-time feedback control strategies are compared for two experimental applications: single-wafer CVD nitride and polysilicon processes
  • Keywords
    closed loop systems; feedback; process control; real-time systems; semiconductor device manufacture; semiconductor process modelling; Si; Si3N4; closed loop system; disturbances; in situ sensors; nonlinearities; polysilicon; process capability index; processing equipment; real-time feedback control; semiconductor manufacturing; single-wafer CVD nitride; Computer aided manufacturing; Electronics industry; Feedback control; Furnaces; Government; Manufacturing processes; Monitoring; Reproducibility of results; Robustness; Thermal loading;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.484287
  • Filename
    484287