Title :
RF electro-thermal modeling of LDMOSFETs for power-amplifier design
Author :
Akhtar, Siraj ; Roblin, Patrick ; Lee, Sunyoung ; Ding, Xiaohui ; Yu, Shuang ; Kasick, Julie ; Strahler, Jeffrey
Author_Institution :
Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
fDate :
6/1/2002 12:00:00 AM
Abstract :
A new approach for the electro-thermal modeling of LDMOSFETs for power-amplifier design that bypasses pulsed-IVs and pulsed-RF measurements is presented in this paper. The existence of low-frequency dispersion in LDMOSFETs is demonstrated by comparing pulsed IVs with iso-thermal IVs. The modeling technique uses iso-thermal IV and microwave measurements to obtain the temperature dependence of small-signal parameters. Optimized tensor-product B-splines, which distribute knots to minimize fitting errors, are used to represent the small-signal parameters and extract the large-signal model as a function of voltages and temperature. The model is implemented on ADS and is verified by simulating and measuring the power harmonics and IMD large-signal performance of a power amplifier. The impact on the model of temperature-dependent drain and gate charge is investigated. The presented model is found to compare well and, in some cases, exceed the existing MET model for LDMOSFETs
Keywords :
MOSFET; equivalent circuits; harmonics; microwave field effect transistors; semiconductor device models; splines (mathematics); B-spline representation; LDMOSFETs; RF electro-thermal modeling; fitting errors; gate charge; iso-thermal IVs; large-signal model; low-frequency dispersion; microwave measurements; nonquasi-static equivalent circuit; optimized tensor-product B-splines; power harmonics; power-amplifier design; pulsed IVs; small-signal parameters; temperature-dependent drain charge; Microwave measurements; Microwave theory and techniques; Power amplifiers; Power measurement; Power system harmonics; Pulse measurements; Radio frequency; Spline; Temperature dependence; Voltage;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2002.1006418