• DocumentCode
    757251
  • Title

    Managing design and test challenges

  • Volume
    26
  • Issue
    2
  • fYear
    2009
  • Firstpage
    4
  • Lastpage
    4
  • Abstract
    Risks are notably increasing in the design of complex SoCs at the 65-nm technology node and beyond. Escalating design costs, increasing profitability and time-to-market pressures, and skyrocketing power consumption—in conjunction with a lower first-silicon success rate, and lower chip manufacturability and reliability—are among the key challenges that chip makers are confronting. To minimize the risks in the face of these challenges requires skillful management of the design process, which has become a core competency of leading chip makers. This issue of Design & Test features a special issue on the management of emerging SoC development. The special issue consists of four articles, contributed by experienced design managers from leading semiconductor companies. In addition, four general-interest articles address diverse design and test issues.
  • Keywords
    Built-in self-test; Chip scale packaging; Costs; Manufacturing; Process design; Profitability; Risk management; Technology management; Testing; Time to market; SoC development; design and test; design challenges; design management;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2009.40
  • Filename
    4850402