DocumentCode :
757798
Title :
Stability of N-channel polysilicon thin-film transistors with ECR plasma thermal gate oxide
Author :
Lee, Jung-Yeal ; Han, Chul-Hi ; Kim, Choong-ki
Author_Institution :
Hyundai Electron. Ind. Co., Kyungki, South Korea
Volume :
17
Issue :
4
fYear :
1996
fDate :
4/1/1996 12:00:00 AM
Firstpage :
169
Lastpage :
171
Abstract :
The effects of electrical stress on n-channel polysilicon thin-film transistors (poly-Si TFTs) with electron cyclotron resonance (ECR) plasma gate oxide have been investigated. The plasma-hydrogenerated low-temperature (/spl les/600/spl deg/C) TFT\´s exhibited very a small increase of threshold voltage (/spl Delta/V/sub th/<0.3 V) under the stress conditions (V/sub gs/=15 V, V/sub ds/=0 V /spl sim/15 V, and stress time=5/spl times/10/sup 4/ s). The /spl Delta/V/sub t/h was larger for the stress in the linear region than in the saturation region. It was found that the device degradation for the stress in the saturation region was caused by the hot-carriers. Increase of OFF current was maximum for the stress at V/sub gs/=V/sub ds/ while for the stress at V/sub gs/\n\n\t\t
Keywords :
elemental semiconductors; hot carriers; plasma deposition; semiconductor device reliability; semiconductor device testing; silicon; thin film transistors; 0 to 15 V; 5E4 s; ECR plasma thermal gate oxide; N-channel polysilicon thin-film transistors; Si; electrical stress; hot-carriers; linear region; saturation region; stress conditions; stress time; threshold voltage; transconductance degradation; Cyclotrons; Degradation; Electrons; Hot carriers; Plasma stability; Resonance; Stress; Thin film transistors; Threshold voltage; Transconductance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.485163
Filename :
485163
Link To Document :
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