DocumentCode :
757951
Title :
Formation of atomic point contacts and molecular junctions with a combined mechanical break junction and electrodeposition method
Author :
Li, X.L. ; Hua, S.Z. ; Chopra, H.D. ; Tao, N.J.
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., AZ
Volume :
1
Issue :
2
fYear :
2006
fDate :
12/1/2006 12:00:00 AM
Firstpage :
83
Lastpage :
88
Abstract :
A method to create atomic point contacts and molecular junctions by combining mechanically controlled break junction and electrochemical deposition/etching techniques is described. This approach provides both stability and flexibility, and is suitable for studying electron transport properties of single molecule junctions or atomic point contacts in aqueous solutions and under potential control. Using the approach, the electron transport properties of 4,4´-bipyridine as a function of electrochemical gate and Ni point contacts have been studied
Keywords :
electrodeposition; etching; molecular electronics; nickel; organic compounds; point contacts; 4,4´-bipyridine; Ni; Ni point contacts; aqueous solutions; atomic point contacts; electrochemical gate; electrodeposition method; electron transport properties; etching; flexibility; mechanical break junction; molecular junctions; potential control; stability;
fLanguage :
English
Journal_Title :
Micro & Nano Letters, IET
Publisher :
iet
ISSN :
1750-0443
Type :
jour
Filename :
4140876
Link To Document :
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