DocumentCode :
758015
Title :
Current-mode signaling in deep submicrometer global interconnects
Author :
Bashirullah, Rizwan ; Liu, Wentai ; Cavin, Ralph K., III
Author_Institution :
Dept. of Electr. Eng., North Carolina State Univ., Research Triangle Park, NC, USA
Volume :
11
Issue :
3
fYear :
2003
fDate :
6/1/2003 12:00:00 AM
Firstpage :
406
Lastpage :
417
Abstract :
This paper addresses propagation delay and power dissipation for current mode signaling in deep submicrometer global interconnects. Based on the effective lumped element resistance and capacitance approximation of distributed RC lines, simple yet accurate closed-form expressions of delay and power dissipation are presented. A new closed-form solution of delay under step input excitation is first developed, exhibiting an accuracy that is within 5% of SPICE simulations for a wide range of parameters. The usefulness of this solution is that resistive load termination for current mode signaling is accurately modeled. This model is then extended to a generalized delay formulation for ramp inputs with arbitrary rise time. Using these expressions, the optimum-line width that minimizes the total delay for current mode circuits is found. Additionally, a new power-dissipation model for current-mode signaling is developed to understand the design tradeoffs between current and voltage sensing. Based on the results and derived formulations, a comparison between voltage and current mode repeater insertion for long global deep submicrometer interconnects is presented.
Keywords :
SPICE; circuit simulation; delays; integrated circuit design; integrated circuit interconnections; SPICE simulations; arbitrary rise time; capacitance approximation; closed-form expressions; current mode signaling; current-mode signaling; deep submicrometer global interconnects; design tradeoffs; distributed RC lines; effective lumped element approximation; optimum-line width; power dissipation; propagation delay; repeater insertion; resistance approximation; step input excitation; total delay; Capacitance; Closed-form solution; Current mode circuits; Delay effects; Integrated circuit interconnections; Power dissipation; Propagation delay; SPICE; Signal design; Voltage;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2003.812366
Filename :
1218214
Link To Document :
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