• DocumentCode
    758212
  • Title

    Thermomechanical analyses of laser precision joining for optoelectronic components

  • Author

    Chang, Won Seok ; Na, Suck Joo

  • Author_Institution
    Nano Process Group, Korea Inst. of Machinery & Mater., Daejeon, South Korea
  • Volume
    26
  • Issue
    2
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    349
  • Lastpage
    358
  • Abstract
    Thermomechanical analyses in laser-spot-welding (LSW) technique for a dual-in-line (DIP) type package has been studied experimentally and numerically to predict post-weld-shift (PWS). Experimental results show that the PWS of optoelectronic component changes sensitively depending on process parameters such as laser energy, beam delivery position, weld joint design and so on. This indicates that the PWS in laser packaging can be minimized by properly controlling the process parameters. A finite element method (FEM) has been carried out on the analysis of the effect of laser parameters and geometry of joint variation on PWS in laser packaging. And experimental studies of laser spot welding and electronic speckle pattern interferometry (ESPI) have also been conducted to validate the numerical model. A satisfactory agreement between the experimental results and FEM calculations suggests that the FEM provides one of the effective methods for predicting the PWS and optimizing package design in LSW technique for optoelectronic packaging. By using the numerical method above this work has led to an understanding of the effect of laser energy variation and joint design on thermal distortion. Hence the PWS can be controlled to produce a reliable laser module with high yield and high performance.
  • Keywords
    electronic speckle pattern interferometry; finite element analysis; laser beam welding; optoelectronic devices; packaging; dual-in-line package; electronic speckle pattern interferometry; finite element method; laser packaging; laser precision joining; laser spot welding; numerical analysis; optoelectronic component; post-weld-shift; thermomechanical analysis; Electronic packaging thermal management; Electronics packaging; Laser beams; Laser modes; Laser noise; Laser transitions; Optical control; Optical design; Thermomechanical processes; Welding;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.815100
  • Filename
    1218231