DocumentCode
758212
Title
Thermomechanical analyses of laser precision joining for optoelectronic components
Author
Chang, Won Seok ; Na, Suck Joo
Author_Institution
Nano Process Group, Korea Inst. of Machinery & Mater., Daejeon, South Korea
Volume
26
Issue
2
fYear
2003
fDate
6/1/2003 12:00:00 AM
Firstpage
349
Lastpage
358
Abstract
Thermomechanical analyses in laser-spot-welding (LSW) technique for a dual-in-line (DIP) type package has been studied experimentally and numerically to predict post-weld-shift (PWS). Experimental results show that the PWS of optoelectronic component changes sensitively depending on process parameters such as laser energy, beam delivery position, weld joint design and so on. This indicates that the PWS in laser packaging can be minimized by properly controlling the process parameters. A finite element method (FEM) has been carried out on the analysis of the effect of laser parameters and geometry of joint variation on PWS in laser packaging. And experimental studies of laser spot welding and electronic speckle pattern interferometry (ESPI) have also been conducted to validate the numerical model. A satisfactory agreement between the experimental results and FEM calculations suggests that the FEM provides one of the effective methods for predicting the PWS and optimizing package design in LSW technique for optoelectronic packaging. By using the numerical method above this work has led to an understanding of the effect of laser energy variation and joint design on thermal distortion. Hence the PWS can be controlled to produce a reliable laser module with high yield and high performance.
Keywords
electronic speckle pattern interferometry; finite element analysis; laser beam welding; optoelectronic devices; packaging; dual-in-line package; electronic speckle pattern interferometry; finite element method; laser packaging; laser precision joining; laser spot welding; numerical analysis; optoelectronic component; post-weld-shift; thermomechanical analysis; Electronic packaging thermal management; Electronics packaging; Laser beams; Laser modes; Laser noise; Laser transitions; Optical control; Optical design; Thermomechanical processes; Welding;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.815100
Filename
1218231
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