Title :
Microprobe array with electrical interconnection for thermal imaging and data storage
Author :
Lee, Dong-Weon ; Ono, Takahito ; Abe, Takashi ; Esashi, Masayoshi
Author_Institution :
Fac. of Eng., Tohoku Univ., Sendai, Japan
fDate :
6/1/2002 12:00:00 AM
Abstract :
In this work, new novel methods for fabricating a thermal probe array with 32 × 32 probes on one chip are proposed. It consists of silicon micromachined probe, AlN actuator, pyramidal SiO2 tip on which the nano-scale metal-metal junction is formed using a self-alignment technique. The nano-junction can be used as a thermocouple to measure a local temperature on a sample surface or as a nano-heater to make a local deformation on a media. Using the fabricated thermal probe, temperature distribution is measured on a prepared sample surface and the local heating capability of the thermal probe is confirmed. Preliminary experiments for data writing and reading are performed on a phase change medium
Keywords :
elemental semiconductors; infrared imaging; microactuators; micromachining; nanotechnology; silicon; thermocouples; Si-SiO2; actuator; data reading; data storage; data writing; electrical interconnection; local deformation; local temperature; micromachined probe; microprobe array; nano-heater; nano-scale metal-metal junction; phase change medium; pyramidal tip; self-alignment technique; thermal imaging; thermal probe array; thermocouple; Dry etching; Glass; Memory; Optical films; Oxidation; Probes; Semiconductor device measurement; Silicon; Temperature measurement; Thermal sensors;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2002.1007400