• DocumentCode
    758259
  • Title

    Characterization of fritting phenomena on Al electrode for low contact force probe card

  • Author

    Kataoka, Kenichi ; Itoh, Toshihiro ; Suga, Tadatomo

  • Author_Institution
    Univ. of Tokyo, Japan
  • Volume
    26
  • Issue
    2
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    382
  • Lastpage
    387
  • Abstract
    We have investigated the characteristics of fritting of thin oxide film on an aluminum electrode for application to a probe card with low contact force. The fritting is a kind of electric breakdown of oxide film on metal electrode. It can be utilized for making electric contacts between the test probe and the electrode on LSI chips without a large force. The voltage and the contact force needed to cause fritting on a sputtered Al film was measured using W, BeCu and Pd needle probes. The contact resistance was also measured. A fritting was occurred by applying a contact load of 1 mN and voltage of 5 V. The contact resistance decreases with increasing the maximum current that passes through the contact. A current of 500 mA is enough to obtain the contact resistance of 1 Ω, which is low enough in practical test of signal lines. No damages were found on the Al film by optical microscope and scanning electron microscope observation.
  • Keywords
    aluminium; contact resistance; electric breakdown; electrodes; integrated circuit testing; large scale integration; mechanical contact; metallic thin films; probes; smart cards; sputtered coatings; 1 ohm; 5 V; 500 mA; Al; BeCu; LSI chip; Pd; W; aluminum electrode; contact force; contact resistance; electric breakdown; fritting phenomena; needle probe; optical microscopy; oxide film; probe card; scanning electron microscopy; signal line testing; sputtered film; Contact resistance; Electrical resistance measurement; Electrodes; Force measurement; Optical films; Optical microscopy; Probes; Semiconductor device measurement; Testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.815102
  • Filename
    1218235