Three-dimensional microfabrication by localized electrochemical deposition

Author

Madden, John D. ; Hunter, Ian W.

Author_Institution

Dept. of Mech. Eng., MIT, Cambridge, MA, USA

Volume

5

Issue

1

fYear

1996

fDate

3/1/1996 12:00:00 AM

Firstpage

24

Lastpage

32

Abstract

A microfabrication technology capable of electrodepositing truly three-dimensional metal structures is introduced. Micrometer-scale nickel structures including a multicoiled helical spring have been fabricated. Electrodeposition is localized by placing a sharp-tipped electrode in a plating solution, near a substrate, and applying a voltage. Structures are built by moving the electrode appropriately with respect to the substrate. Vertical deposition rates of 6 μm/s are observed, two orders of magnitude greater than those of conventional electrodeposition. The theory of mass transport to a region of localized field is discussed, and a model of deposition profile is presented. The process can potentially produce submicrometer feature sizes using a range of materials including pure metals, alloys, and polymers

Keywords

electrochemistry; electroplating; micromechanical devices; nickel; Ni; localized electrochemical deposition; mass transport; microfabrication; multicoiled helical spring; plating; three-dimensional metal structures; Building materials; Chemical lasers; Electrodes; Lithography; Microelectronics; Optical materials; Polymers; Prototypes; Silicon; Springs;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.485212

Filename

485212