• DocumentCode
    758614
  • Title

    Low-threshold pulsed operation of long-wavelength lasers on Si fabricated by direct bonding

  • Author

    Mori, K. ; Tokutome, K. ; Sugou, S.

  • Author_Institution
    Opto-Electron. Res. Labs., NEC Corp., Ibaraki, Japan
  • Volume
    31
  • Issue
    4
  • fYear
    1995
  • fDate
    2/16/1995 12:00:00 AM
  • Firstpage
    284
  • Lastpage
    285
  • Abstract
    Low-threshold room-temperature pulsed operation of InGaAs-InGaAsP multiquantum-well (MQW) lasers (λ≃1.55 μm) on Si substrates is demonstrated. These laser structures were first grown on InP substrates, then bonded at 700°C onto Si substrates with buffer layers. The mesa-stripe broad-area lasers have a threshold current density of 1.7 kA/cm2 (50 μm mesa width, 330 μm cavity length), which is comparable to the value for lasers on InP substrates
  • Keywords
    III-V semiconductors; gallium arsenide; gallium compounds; indium compounds; integrated optoelectronics; laser transitions; optical fabrication; quantum well lasers; silicon; wafer bonding; 1.55 micron; 700 C; InGaAs-InGaAsP; InP; InP substrates; MQW lasers; OEIC; Si; Si substrates; buffer layers; direct bonding; long-wavelength lasers; low-threshold pulsed operation; mesa-stripe broad-area lasers; multiquantum-well lasers; room-temperature operation; threshold current density;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19950179
  • Filename
    375842