Title :
Self-aligned flip-chip packaging of tilted semiconductor optical amplifier arrays on Si motherboard
Author :
Hunziker, W. ; Vogt, W. ; Melchior, H. ; Leclerc, D. ; Brosson, P. ; Pommereau, F. ; Ngo, R. ; Doussiere, P. ; Mallecot, F. ; Fillion, T. ; Wamsler, I. ; Laube, G.
Author_Institution :
Inst. of Quantum Electron., Swiss Federal Inst. of Technol., Zurich, Switzerland
fDate :
3/16/1995 12:00:00 AM
Abstract :
An optical self-aligned flip-chip packaging technique for tilted semiconductor optical amplifier arrays is reported. It uses a Si motherboard with V-grooves for self-alignment between the tilted SOA array and angle polished fibre arrays. Fibre-to-fibre gain of 14±1 dB and ripple ±0.1 dB without antireflection coating on the fibres have been achieved
Keywords :
flip-chip devices; integrated circuit packaging; integrated optoelectronics; modules; semiconductor laser arrays; 14 dB; OEIC chip packaging; Si; Si motherboard; V-grooves; angle polished fibre arrays; self-aligned flip-chip packaging; tilted semiconductor optical amplifier arrays;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19950293
