Supercomputers-interconnections and packaging

Author

Watson, G.F.

Volume

Issue

fYear

1992

fDate

9/1/1992 12:00:00 AM

Firstpage

Lastpage

Abstract

The packaging requirements imposed by 1-GHz clock rates and ways to meet them are considered. For supercomputers, many more input/output connections must be squeezed into less space and greater quantities of heat must be removed, also in less space. To cope with these problems, engineers are adding more interconnection layers, multichip modules, adopting exotic materials, such as diamond, and are exploring new technologies, such as high-temperature superconductivity. Each of these approaches is examined

Keywords

cooling; integrated circuit technology; packaging; 1 GHz; 1-GHz clock rates; diamond; exotic materials; high-temperature superconductivity; input/output connections; interconnection layers; multichip modules; Clocks; Computer aided manufacturing; Heat engines; Integrated circuit interconnections; Packaging; Space heating; Space technology; Substrates; Supercomputers; Thermal conductivity;

fLanguage

English

Journal_Title

Spectrum, IEEE

Publisher

ieee

ISSN

0018-9235

Type

jour

DOI

10.1109/6.155713

Filename

155713

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=759468