• DocumentCode
    759470
  • Title

    Leaky insulating paint for preventing discharge anomalies on circuit boards

  • Author

    Frederickson, A.R. ; Nanevicz, J.E. ; Thayer, J.S. ; Enloe, C. Lon ; Mullen, E.G. ; Parkinson, D.B.

  • Author_Institution
    US Air Force Geophys. Lab., Hanscom AFB, MA, USA
  • Volume
    36
  • Issue
    6
  • fYear
    1989
  • fDate
    12/1/1989 12:00:00 AM
  • Firstpage
    1405
  • Lastpage
    1410
  • Abstract
    A semi-insulting paint has been formulated and tested for preventing pulse discharges from causing damage to circuits on heavily irradiated circuit boards. The paint is tin-oxide-filled phenoxy resin with a bulk resistivity of 108 ohm-cm. A typical coating is then 1010 ohms per square. It is applied over the finished, conformally coated circuit board and connected to ground where possible on the board. It works by minimizing the stored electric field energy prior to the discharge. With such high resistivity it cannot load down most circuits. Tests were performed on circuit boards with and without the paint using energetic electron beams to simulate very high space exposure levels. Many potential damaging pulses were seen without the paint; application of the paint removed all large pulses, and only a few small pulses were seen
  • Keywords
    aerospace instrumentation; electron beam effects; filled polymers; polymer films; printed circuits; protective coatings; radiation hardening (electronics); semiconductors; PCBs; bulk resistivity; energetic electron beams; filled phenoxy resin; heavily irradiated circuit boards; high space exposure levels simulation; leaky insulating paint; preventing discharge anomalies on circuit boards; preventing pulse discharges; semi-insulting paint; semiinsulating paint; sheet resistivity; Circuit testing; Coatings; Conductivity; Electron beams; Insulation; Paints; Performance evaluation; Printed circuits; Pulse circuits; Resins;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.45455
  • Filename
    45455