• DocumentCode
    759489
  • Title

    Diffraction by a symmetric material junction simulated with generalized sheet transition conditions

  • Author

    Ricoy, Mark A. ; Volakis, John L.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    40
  • Issue
    7
  • fYear
    1992
  • fDate
    7/1/1992 12:00:00 AM
  • Firstpage
    742
  • Lastpage
    754
  • Abstract
    When diffraction by a material discontinuity in a thick dielectric/ferrite slab is treated by the dual integral equation approach (a variation of the Weiner-Hopf method), the resulting solution displays unknown constants, characteristic of the incompleteness associated with the generalized transition conditions employed in modeling a thick slab. The constants can be shown to depend on the geometry and properties of the discontinuity. Their explicit determination by enforcing field continuity across the slab junction is treated. The field internal to the slab is determined by first expressing the field as an expansion of discrete and continuous eigenmodes valid in the exterior and interior slab region. The expansion or mode coefficients are then identified by recasting the Weiner-Hopf solution in a suitable form, enabling the solution constants to be numerically computer by matching the field expansions to the left and right of the slab discontinuity at a discrete set of points
  • Keywords
    electromagnetic wave diffraction; Weiner-Hopf solution; dual integral equation approach; eigenmodes; electromagnetic diffraction; expansion coefficients; generalized sheet transition conditions; material discontinuity; mode coefficients; symmetric material junction; symmetric multilayer slab; thick dielectric/ferrite slab; Boundary conditions; Context modeling; Dielectric materials; Diffraction; Displays; Ferrites; Integral equations; Senior members; Sheet materials; Slabs;
  • fLanguage
    English
  • Journal_Title
    Antennas and Propagation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-926X
  • Type

    jour

  • DOI
    10.1109/8.155738
  • Filename
    155738