DocumentCode
759612
Title
Breakdown walkout in pseudomorphic HEMT´s
Author
Menozzi, Roberto ; Cova, Paolo ; Canali, Claudio ; Fantini, Fausto
Author_Institution
Dipartimento di Ingegneria dell´´Inf., Parma Univ., Italy
Volume
43
Issue
4
fYear
1996
fDate
4/1/1996 12:00:00 AM
Firstpage
543
Lastpage
546
Abstract
In this work we show for the first time evidence of gate-drain breakdown walkout due to hot electrons in pseudomorphic AlGaAs-InGaAs-GaAs HEMTs (PHEMTs). Experiments performed on passivated commercial PHEMTs show that hot electron stress cycles induce a large and permanent increase of the gate-drain breakdown voltage. Three-terminal and two-terminal stress conditions are compared, the former producing a much larger walkout due to hot electrons flowing in the channel. Experimental results indicate that a build-up of negative charge in the region between gate and drain is responsible for the breakdown walkout, due to a local widening of the depletion region and a reduction of the peak electric field
Keywords
III-V semiconductors; aluminium compounds; electric breakdown; gallium arsenide; high electron mobility transistors; hot carriers; impact ionisation; indium compounds; AlGaAs-InGaAs-GaAs; PHEMT; depletion region widening; gate-drain breakdown walkout; hot electron stress cycles; hot electrons; negative charge buildup; peak electric field reduction; pseudomorphic HEMT; three-terminal stress conditions; two-terminal stress conditions; Electric breakdown; Electrons; Gallium arsenide; HEMTs; Impact ionization; Indium gallium arsenide; Irrigation; MODFETs; PHEMTs; Stress; Student members; Testing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.485535
Filename
485535
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