• DocumentCode
    759612
  • Title

    Breakdown walkout in pseudomorphic HEMT´s

  • Author

    Menozzi, Roberto ; Cova, Paolo ; Canali, Claudio ; Fantini, Fausto

  • Author_Institution
    Dipartimento di Ingegneria dell´´Inf., Parma Univ., Italy
  • Volume
    43
  • Issue
    4
  • fYear
    1996
  • fDate
    4/1/1996 12:00:00 AM
  • Firstpage
    543
  • Lastpage
    546
  • Abstract
    In this work we show for the first time evidence of gate-drain breakdown walkout due to hot electrons in pseudomorphic AlGaAs-InGaAs-GaAs HEMTs (PHEMTs). Experiments performed on passivated commercial PHEMTs show that hot electron stress cycles induce a large and permanent increase of the gate-drain breakdown voltage. Three-terminal and two-terminal stress conditions are compared, the former producing a much larger walkout due to hot electrons flowing in the channel. Experimental results indicate that a build-up of negative charge in the region between gate and drain is responsible for the breakdown walkout, due to a local widening of the depletion region and a reduction of the peak electric field
  • Keywords
    III-V semiconductors; aluminium compounds; electric breakdown; gallium arsenide; high electron mobility transistors; hot carriers; impact ionisation; indium compounds; AlGaAs-InGaAs-GaAs; PHEMT; depletion region widening; gate-drain breakdown walkout; hot electron stress cycles; hot electrons; negative charge buildup; peak electric field reduction; pseudomorphic HEMT; three-terminal stress conditions; two-terminal stress conditions; Electric breakdown; Electrons; Gallium arsenide; HEMTs; Impact ionization; Indium gallium arsenide; Irrigation; MODFETs; PHEMTs; Stress; Student members; Testing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.485535
  • Filename
    485535